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Backlight LED device
背光LED器件
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01.JP.ZC4010W65P00
適用於所有的SMT组装和焊接工艺
封裝尺寸:4.0*1.2*0.55mm
超薄
防潮等級Level3
適用於所有的SMT组装和焊接工艺
包裝每卷4000PCS